Bose QuietComfort Ultra is lighter, simpler and more fashionable in appearance. Equipped with the latest Bose immersive spatial audio technology, it can simulate live listening and enhance the immersion of headphone listening. It supports intelligent in-ear sound field adjustment technology, which can adjust the sound and active noise cancellation technology according to the shape of different ear canals, and tailor-made exclusive sound effects. The built-in advanced microphone array can accurately pick up human voices and eliminate most of the surrounding environmental noise.
Bose QuietComfort Ultra is equipped with the 2nd-generation Qualcomm S5 audio platform and supports Bluetooth 5.3 and Snapdragon Sound technology – when used with a mobile phone that supports Snapdragon Sound, it can provide CD-level lossless audio transmission, ultra-low latency gaming experience, and stable wireless connection . The battery life in ANC/transparency mode is up to 24 hours, and the battery life in audio mode is 18 hours. Supports fast charging, charging for 15 minutes can provide 2.5 hours of listening time.
We have also previously teardown the Bose products including: BOSE QuietComfort 45, Bose NC700, Bose QuietComfort 35 II, BOSE QuietComfort Earbuds II, Bose QuietComfort Earbuds, Bose Sport Earbuds and BOSE SOUNDSPORT FREE. Let’s take a look at the detailed teardown report of Bose QuietComfort Ultra.
01/ Bose QuietComfort Ultra Headphones Teardown
Remove the snap-on ear cup on the left headphone.
The sound chamber cover is protected by a dust-proof net.
Open the dust filter to reveal the sound chamber cover structure below. There is a sponge pad on the inside of the dust filter, which is fixed to the sound cavity cover through double-sided tape.
There is a sound hole for the speaker, and there is a rear feedback microphone under the middle grille.
Another rear feedback microphone on the cover.
The inverter tube used for tuning is protected by a wire mesh.
Remove the screws and open the headphone cavity. The left headphone has a built-in battery, motherboard and power input board.
The wire tube used for tuning corresponds to the tuning hole of the sound cavity.
The tuning holes on the sound cavity cover are one big and one small.
Feedback noise cancelling microphone FPC. The speaker wires are soldered to the FPC.
Open the back cover of the sound chamber.
After actual measurement, the speaker diameter is approximately 35mm.
The internal structure of the left headphone cavity. There are 4 microphones arranged around the cavity to pick up sound from multiple directions.
The power input board structure is fixed with screws, and the Type-C charging stand and indicator light are wrapped in black sponge.
The microphone FPC circuit is connected to the motherboard through the BTB connector.
Another FPC to connect the microphone.
Laser-engraved 169D18 MEMS microphone. There are 6 microphones inside the left headphone, which are used for voice calls and noise cancelling function.
The tuning hole on the cavity wall is protected by a wire mesh on the inside.
The headphone has a built-in rechargeable lithium-ion battery pack, model number: 503337PN2, rated capacity: 750mAh, rated energy: 2.775Wh, nominal voltage: 3.7V, charging limit voltage: 4.2V.
Tear off the insulating protective film and see the battery protection board circuit – equipped with lithium battery protection IC, MOS tube and thermistor.
Silk screen 272 TJ’s lithium battery protection IC is responsible for battery overcharge, overdischarge, and overcurrent protection.
Silk screen 6K2 024 MOS tube.
The circuit on one side of the headphone motherboard.
The circuit on the other side of the headphone motherboard.
The onboard bluetooth antenna.
Silk screen 73Q4 low pass filter.
Qualcomm QCC5181 bluetooth audio SoC is part of the second-generation Qualcomm S5 audio platform. Supports Bluetooth 5.4 and is fully compliant with the requirements for supporting the new Bluetooth LE Audio (low energy consumption audio) – including Auracast broadcast audio. Supports Snapdragon Sound technology and brings new features to it – including dynamic head-tracking spatial audio, 48kHz lossless music streaming, and 48ms low-latency gaming experience.
Snapdragon Sound supports Qualcomm aptX audio codec technology – including aptX Adaptive, up to 24bit/96KHz. Supports aptX Voice technology, eighth-generation Qualcomm cVc echo cancellation and noise suppression technology. Integrated Qualcomm adaptive active noise cancelling (ANC) technology – including feedforward, feedback, hybrid and adaptive, supporting third-party innovation through Qualcomm extensions.
Silk screen C 2EX IC.
ST STM32U585OI ultra-low power MCU. The STM32U585xx series is based on the high-performance Arm Cortex-M33 32-bit RISC core, operating at up to 160MHz, and the core has a single-precision FPU (Floating Point Unit). Supports all Arm single-precision data processing instructions and all data types. The kernel also implements DSP (Digital Signal Processing) instructions and an MPU (Memory Protection Unit) to enhance application security, which enhances application security.
Silk screen 6EM IC.
Connect the microphone and power input board to the BTB connector of the FPC.
Connect the BTB connector of the microphone FPC.
Connect the ZIF connector of the FPC to the speaker and feedback microphone.
Silk screen AL K1 IC.
Two silk screen 71215 BCBZ noise cancellingICs from ADI and customized by Bose.
Silk screen 113P IC. Silk screen VL 103 gyroscope IC for spatial audio functionality.
Silk screen Q128J’s external memory is used to store firmware information.
The circuitry on one side of the power input board.
The circuit on the other side of the power input board.
Silk screen R87 L2AH IC.
LED indicator light for feedback on charging status.
Remove the earmuff of the right headphone.
Right headphone cavity cover structure – compared to the left headphone, a large-area capacitive wearing detection sensor is added.
Capacitive wearing detection sensor is used to detect the wearing status – to automatically pause playback when taking off the headphones and resume playback after wearing them.
Feedback microphone inside the headphone.
Inverter tube for tuning.
Open the sound cavity. There is a PCB board, touch sensor and microphone inside the cavity. The structure on the back of the sound chamber is the same as that of the left headphone.
Microphone FPC circuit inside the cavity.
In addition to the microphone structure, the right headphone is also equipped with 6 microphones.
The inner structure of the bluetooth pairing button.
The inner structure of the multi-function button has a metal backplate to increase durability.
Remove the screws and function key board.
There is an orange rubber pad on the inside of the function key cap to cushion the instantaneous pressure on the micro switch.
Touch detection sensor for volume adjustment.
The microphone FPC is connected to the PCB board via BTB connector.
The circuit on one side of the PCB board is soldered to the left headphone wire.
The circuit on the other side of the PCB board.
Silk screen XA3 J3 IC.
Infineon PSoC 4000S series MCU, silk screen model number “CY8C4025FNI-S412”, used for touch detection function. PSoC 4 is a scalable and reconfigurable platform architecture for a family of programmable embedded system controllers based on Arm Cortex-M0+CPU. It integrates programmable and reconfigurable analog and digital modules with the ability to flexibly and automatically route resources.
The PSOC 4000S product family is a member of the PSOC 4 platform architecture. The product family integrates microcontrollers with standard communications and timing peripherals, a best-in-class performance capacitive touch sensing (CapSense) system, programmable general-purpose, continuous and switched-capacitor analog blocks, and programmable interfaces. In response to new application and design requirements, PSOC 4000S products are upwardly compatible with the PSOC 4 platform series products.
All components of Bose QuietComfort Ultra noise canceling headphones.
02/ Summary
The appearance of Bose QuietComfort Ultra is more integrated, the look and feel is more simple and fashionable, and it is more in line with the current aesthetic. At the same time, through the combination of different materials, the product texture is even better. It retains the perfect functions of the appearance structure, and upgrades it to an infinitely adjustable head beam slide rail and more enveloping earmuffs, further improving the user experience.
The left and right headphones are equipped with 35mm dynamic drivers, each with 6 built-in MEMS microphones (12 in total), the most in the history of the QuietComfort series – thus providing more accurate sound pickup for voice calls and noise cancelling functions. The left headphone contains the battery and motherboard. The right headphone is equipped with wear detection and touch detection sensors, and is supported by Infineon PSoC 4000S series MCU.
The motherboard uses the 2nd-generation Qualcomm S5 audio platform (QCC5181), supports Bluetooth 5.4 and Snapdragon Sound technology, provides high-definition wireless audio, and dynamic head tracking spatial audio. It also uses two ADI noise canceling IC and ST STM32U585OI MCU, etc.
PS: Translated from 52audio
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