SoundPEATS Air4 adopts an ergonomic ear-fitting curve with a 45° included angle, making them stable and comfortable to wear. It uses Qualcomm 3071 Bluetooth 5.3 chip and supports Snapdragon Sound technology and Qualcomm aptX Lossless. It is also compatible with aptX AdaptiveHD, APTX Low Latency and aptX HD audio decoding.
SoundPEATS Air4 supports adaptive ANC function, which can intelligently identify ear structure, wearing status, and surrounding environmental noise, and adjust noise cancellation parameters in real time. Supports 6-MIC CVC call noise cancellation – based on the built-in microphone array and noise cancellation algorithm to provide clear calls. Supports low-latency game mode, with full-link latency as low as 88ms. The single battery life is up to 6.5 hours, and the total battery life is about 26 hours.
We have previously teardown the SoundPEATS products including: SoundPEATS Capsule3 Pro, SoundPEATS Mini Pro HS, SoundPEATS Air3 Deluxe HS, and SoundPEATS TrueAir2. Let’s take a look at the detailed teardown report of SoundPEATS Air 4.
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$49 – SoundPEATS Air4 Review
01/ SoundPEATS Air4 Charging Case Teardown
Open the charging case shell and take out the charging bin structure.
Remove the screws and take out the power input board inside the housing.
The front structure of the charging bin, the mainboard connects the indicator light and function key board through FPC.
The structure on the back of the charging bin is equipped with a battery.
The main board structure at the bottom of the charging bin is fixed with screws.
Remove the screws and remove all components from the charging bin.
Charging case built-in lithium battery model: YJ701435, nominal voltage: 3.7V, rated capacity: 300mAh 1.221Wh, from YJ.
Tear off the insulating protective film and protect the circuit on one side of the battery board.
Silk screen DW01 lithium battery protection IC is responsible for battery overcharge, overdischarge, and overcurrent protection.
Silk screen 8205A MOS tube.
The circuit on the side of the charging case motherboard.
The circuit on the other side of the charging case motherboard.
Metal dome for connecting the power input board.
TPS SY8815 bluetooth headset charging case solution integrates charging module and discharging module. The charging current can be adjusted externally. The discharge module integrates two output current-limiting switches, providing independent load presence detection and load insertion detection – while supporting output current detection.
SY8815 discharge enable control, MCU can flexibly control the chip’s discharge function directly through EN. SY8815 integrates a single-line status code output to facilitate the chip reporting chip status to the MCU. SY8815 is very suitable for the design of charging cases, simplifying peripheral circuits and components, and providing a simple and easy-to-use solution for charging case applications.
Power inductor that works with the power management chip.
Silk screen T18 018 TVS tube for input overvoltage protection.
An unmarked MCU microcontroller.
Metal dome for connecting earbuds to charge them.
Indicator light and function button FPC circuit.
LED indicator light for feedback of bluetooth pairing and charging status.
Micro button for bluetooth pairing.
Hall element FPC circuit.
The hall element with silk screen “qH3c” is used to sense the magnetic field changes when the charging case lid is opened/closed, and then informs the charging case MCU and earbuds to pair or disconnect with the connected device.
02/ SoundPEATS Air4 Earbuds Teardown
Disassemble the earbud cavity. On the right is the front cavity internal speaker.
The internal structure of the rear cavity is equipped with a battery.
Take out the front cavity internal speaker.
The MEMS microphone of Lasdiao 2338 WX02 is a feedback microphone, used for noise cancellation function to pick up sound from inside the ear canal, from XINGANG.
The speaker uses a dynamic driver and a biofiber composite diaphragm to bring better sound quality performance.
On the back of the speaker, the edge tuning hole is protected by a silk screen.
After actual measurement, the speaker diameter is approximately 13mm.
Take out the battery and FPC inside the rear cavity.
From the bottom structure of the rear cavity, you can see the motherboard inside the earbud stem.
The positive electrode of the steel shell button battery built into the earbuds, engraved model: M1040S2, nominal voltage: 3.85V, rated capacity: 35mAh, energy: 0.135Wh.
The circuit of Battery FPC.
The FPC connects to the motherboard’s BTB connector.
Remove the earbud stem back cover. There is a bluetooth antenna and touch detection sensor attached to the inside of the cover.
The circuit on one side of the earbud motherboard.
The circuit on the other side of the earbud motherboard.
Connect the BTB connector of the FPC inside the front cavity.
On the left is the MEMS microphone of Laser Engraving 2338 WX05, which is a feedforward microphone and is used for voice call functions to pick up external environmental noise. In the middle is the Qualcomm QCC3071 bluetooth audio SoC, which is part of the Qualcomm S3 audio platform. The Qualcomm S3 audio platform supports Snapdragon Sound technology, has been optimized and supports dual bluetooth mode – combining traditional bluetooth wireless audio and the new LE Audio technology standard, with full link latency as low as 55ms. Supports aptX Lossless transmission, providing CD-level lossless sound quality.
Qualcomm S3 audio platform supports Bluetooth 5.3, dual bluetooth mode, audio sharing and broadcast integrated LE Audio. Supports multi-point bluetooth wireless connection for seamless switching between devices. Equipped with the third-generation Qualcomm adaptive active noise cancellation technology, it can intelligently adapt to wind noise processing, prevent howling, and provide various wearing fits. Supports transparency mode and aptX Adaptive audio.
A precision wire-wound inductor that powers the internal circuitry of a bluetooth audio SoC.
Silk screen 151BV memory is used to store the bluetooth configuration information of the main control chip.
The metal dome to which the touch detection sensor is connected.
Silk screen 2E IC.
WINSEMI WSDF23C2N2H lithium battery protection IC, belonging to the WSDF23 series, is a highly integrated solution for single-cell lithium-ion/lithium polymer rechargeable battery pack protection. It adopts DFN4L-1X1 ultra-small package, built-in advanced power MOSFET, high-precision voltage detection circuit and delay circuit – it has all the protection functions required by the battery such as overcharge, over-discharge, over-current, short circuit, etc., and consumes very little power when working. Low. It also has a CTL shipping mode setting function.
The laser-engraved YL320 crystal oscillator provides the clock for the bluetooth audio SoC.
Metal dome for connecting bluetooth antenna.
The metal dome is connected to the charging metal tail plug.
The MEMS microphone of Lasdiao 2343 WX18 is a call microphone, used for voice call function pickup.
All components of SoundPEATS Air4 true wireless noise cancellation earphones.
03/ Summary
SoundPEATS Air4 continues the design style of the Air series. The charging case adopts a thin oval design, matte texture, and cleverly hides the indicator light. The long-stem semi-in-ear earbuds use a combination of matte and glossy textures, and the touch area is designed with a gold nameplate, which effectively enhances the sophistication and recognition of the product.
The charging case is equipped with a 300mAh lithium battery, has an independent power input board, and is connected to the motherboard through contacts. The motherboard is equipped with the TPS SY8815 bluetooth headset charging case solution, which integrates the charging module and the discharging module. A single-chip microcomputer is also used for complete machine control.
The FPC inside the earbud head is connected to the 35mAh steel case button battery, 13mm dynamic driver and MEMS feedback microphone, and is connected to the motherboard in the earbud stem through the BTB connector. The motherboard is equipped with Qualcomm QCC3071 bluetooth audio SoC, WINSEMI WSDF23C2N2H lithium battery protection IC, MEMS feedforward microphone and call microphone.
PS: Translated from 52audio
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