Xiaomi Buds 5 Pro is equipped with the Qualcomm S7 audio platform, supports Snapdragon Sound, and has received Hi-Res Audio Wireless certification. It utilizes aptX Lossless technology, enabling 48kHz/24bit high-resolution lossless audio with a transmission rate of up to 2.1Mbps. Additionally, it features Harman tuning, offering Harman AudioEFX and Harman Master EQ.
The Xiaomi Buds 5 Pro incorporates a 3-MIC noise cancellation system, supporting 55dB active noise cancellation (ANC) depth and a 5kHz noise cancellation bandwidth. It introduces a stepless adjustment function for a more personalized noise cancellation experience. The new 3-MIC AI call noise reduction algorithm ensures accurate voice pickup even in 100dB noisy environments while suppressing background noise. It also boasts enhanced wind noise resistance and supports 32K HD calls for clearer voice communication.
Other features include an upgraded 3D spatial audio with dynamic head tracking, independent earphone recording 2.0 for real-time transcription, face-to-face translation, and simultaneous interpretation. It also supports audio sharing, multi-device audio streaming, gaming mode, wireless charging, and more.
We have previously disassembled other Xiaomi/Redmi headphones, including: Xiaomi Buds 5, Redmi Buds 5 Pro, Redmi Buds 4, and Redmi Buds 4 Lite. Below is the detailed teardown report of the Xiaomi Buds 5 Pro.
01/ Xiaomi Buds 5 Pro Charging Case Teardown
Disassemble the charging case and take out the charging bin structure.
The front structure of the charging bin is equipped with an LED indicator and is sealed by a light shield.
The back structure of the charging bin is fixed with a wireless charging receiving coil by a bracket.
Disconnect the FPC solder joint and remove the bracket.
The bottom structure of the charging bin is equipped with an FPC connection indicator, a Hall element and an FPC board.
The battery is fixed inside the bracket, which plays a good protective role.
Remove the FPC at the bottom of the charging bin. FPC circuit inside the charging case.
Pogo Pin connector for charging earbuds.
LED indicator, used to feedback bluetooth pairing and charging status.
The Hall element with silkscreen “AR 4n” is used to sense the magnetic field changes when the charging case lid is opened and closed, and then notify the charging case MCU and earbuds to pair or disconnect with the connected device.
Remove the motherboard, battery and wireless charging receiving coil on the bracket.
The charging case has a built-in lithium-ion polymer battery, model: BW59, nominal voltage: 3.87V, rated capacity: 570mAh, charging limit voltage 4.45V, rated energy: 2.21Wh, manufacturer: Dongguan LIWINON Technology Co., Ltd.
The circuit on one side of the charging case motherboard. The function button on the right is for bluetooth pairing.
The circuit on the other side of the charging case motherboard.
XySemi XB5152UA2SZ integrated lithium battery protection IC is responsible for overcharge, over-discharge and overcurrent protection of the battery.
ConvenientPower CPS4520 wireless charging receiver chip complies with WPC Qi 1.3 protocol. Supports 5W output power, AC and DC voltage regulation, Rx Tx communication, I2C interface and MCU communication, and has a reliable overvoltage/current/temperature protection solution.
IC with silkscreen 2084.
TVS protection tube with silkscreen T18 is used for input overvoltage protection.
TPS SY5321 overvoltage and overcurrent protection IC is a highly integrated IC with input undervoltage and overvoltage protection, load current abnormal protection and overtemperature protection. SY5321 supports 30V input withstand voltage, overvoltage shutdown protection is less than 50nS, and is used in the front end of charging circuits or low-voltage systems to prevent lithium batteries or low-voltage systems from being affected by abnormal input failures.
TPS SY5321 can set the external input overvoltage threshold through the OVP pin, or select the input overvoltage threshold set inside the IC. When the input overvoltage threshold set inside the IC is less than the external overvoltage threshold set by the OVP pin, SY5321 will automatically select the internal overvoltage threshold. Otherwise, the external overvoltage threshold set by the OVP pin is selected.
Chipsea CS32F103CBW6 MCU, integrated with a high-performance ARM Cortex-M3 32-bit RISC core, is responsible for charging case control.
Southchip SC89619D switch-mode buck charger is suitable for 1-cell lithium-ion battery applications and NVDC system power path management.
Southchip SC8753 is a high-efficiency direct charging chip designed for TWS charging case.
02/ Xiaomi Buds 5 Pro Earbuds Teardown
Remove the back cover of the earbud stem. The LDS laser antenna is printed inside the cover. In the middle is the microphone pickup hole, which corresponds to the holes on both sides of the earbud stem.
The internal structure of the cavity adopts a dual PCBA board design and is connected via FPC.
Take out the motherboard and pressure-sensitive buttons inside the earbud stem.
The Pogo Pin connector inside the cavity is used for charging the earbud.
Pressure-sensitive sensor, which supports pressing and sliding control.
The circuit on one side of the motherboard.
The circuit on the other side of the motherboard.
The metal dome connected to the bluetooth antenna and the 6-axis gyroscope with silkscreen I467P – Model: ICM-42670-P, from TDK, used for spatial audio function to collect user head movement data.
AWINIC AW86862 pressure detection IC with “MHGY” printed on it, with pressure sensing signal acquisition, amplification and processing functions.
BTB connector female socket for connecting pressure sensing sensor.
MEMS microphone of laser engraving G436 is a call microphone, used for voice call function to pick up sound.
MEMS microphone of laser engraving G485 is a feedforward noise reduction microphone, used for noise reduction function to pick up ambient noise. HX HX9036 capacitive distance sensor, used for wearing detection function. IC with AH 1v printed on it.
Disassemble the earbud head.
The circuit on one side of the earbud head motherboard.
The circuit on the other side of the earbud head motherboard.
Qualcomm S7 audio platform with “QCC7228” printed on it, with personalized and fast-response audio experience. The computing performance of this platform is 6 times that of S5, the AI performance is improved by 100 times, and it brings a new level of super flagship performance with low power consumption.
The platform supports Bluetooth 5.4 and Bluetooth LE, and provides developers with a 480Mbps USB connection, which enables developers to accelerate audio product development. Integrated PMU, charging, and microphone peripheral device support bring smaller product size. Support Qualcomm 4Gen ANC technology, which can actively adjust the noise reduction level according to the surrounding environment. Support Snapdragon Seamless cross-platform technology, which can achieve seamless connection of multiple devices across multiple operating systems, sharing peripherals and data.
Qualcomm S7 supports Snapdragon Sound technology, including aptX Adaptive, aptX Voice, 8Gen cVc echo cancellation/noise suppression technology, Qualcomm adaptive ANC technology, etc.
BTB connector female connector for connecting the internal components FPC of the cavity.
Metal dome connected to the bluetooth antenna.
Laser engraved T384 crystal oscillator, used to provide clock.
Southchip SC7289 linear charging IC, used to charge the built-in battery.
Remove the battery and speaker inside the cavity. The FPC inside the front cavity connects the in-ear detection sensor and the feed-forward noise reduction microphone.
Remove the battery from the bracket.
The FPC connects to the BTB connector male socket of the motherboard.
Lithium battery protection IC with silkscreen 4c HZ.
The MEMS microphone of the laser engraved G523 is a feed-back noise reduction microphone used to pick up sound from inside the ear canal.
Information on the label of the built-in steel shell button battery of the earphone: model: 1160, rated voltage: 3.85V, charging limit voltage: 4.4V, rated capacity: 53mAh/0.2Wh.
Remove the speaker module from the bracket. According to the official introduction, it adopts a three-unit coaxial design, including 11mm dual-magnet dynamic driver+planar diaphragm driver+piezoelectric ceramic driver.
After actual measurement, the diameter of the dynamic driver is about 11mm.
All components of Xiaomi Buds 5 Pro true wireless earphones.
03/Summary
Xiaomi Buds 5 Pro continues the family design style. The rounded rectangular charging case combines frosted and mirror textures. The stem-shaped in-ear design has the same texture as the charging case.
The charging case is equipped with a 570mAh/3.87V lithium battery and an XySemi XB5152UA2SZ integrated lithium battery protection IC. It uses a ConvenientPower CPS4520 wireless charging receiver chip and a Southchip SC89619D switch-mode buck charger to charge the battery. It also uses two Southchip SC8753 high-efficiency direct charging chips to charge the earbuds. It uses a TPS SY5321 overvoltage and overcurrent protection IC. It uses a Chipsea CS32F103CBW6 MCU for overall control.
The earbuds are equipped with 11mm dual magnetic dynamic driver + planar diaphragm driver + piezoelectric ceramic driver, and built-in 3 MEMS microphones for sound pickup. Qualcomm S7 audio platform is used for wireless connection and audio data processing. AWINIC AW86862 pressure detection IC and HX HX9036 capacitive distance sensor are used. TDK ICM-42670-P 6-axis gyroscope is used to collect head movement data. The earphones have a built-in 53mAh/3.85V steel shell button battery and Southchip SC7289 linear charging IC is used to charge the battery.
PS: Translated from 52audio
